싸니까 믿으니까 인터파크도서

Preface	p. xxi
Basics of Printed Circuit Boards	p. 1
Connectivity in Electronic Equipment	p. 1
Advantages of Printed Circuit Boards	p. 1
Evolution of Printed Circuit Boards	p. 2
Components of a Printed Circuit Board	p. 4
Classification of Printed Circuit Boards	p. 5
Single-sided Printed Circuit Boards	p. 5
Double-sided Printed Circuit Boards	p. 6
Multi-layer Boards	p. 7
Rigid and Flexible Printed Circuit Boards	p. 9
Manufacturing of Basic Printed Circuit Boards	p. 10
Single-sided Boards	p. 10
Double-sided Plated Through-holes	p. 14
Multi-layer Boards	p. 16
Flexible Boards	p. 16
Challenges in Modern PCB Design and Manufacture	p. 17
Major Market Drivers for the PCB Industry	p. 19
PCBs with Embedded Components	p. 21
Standards on Printed Circuit Boards	p. 23
Useful Standards	p. 24
Electronic Components	p. 25
Basics of Electronic Components	p. 25
Active vs Passive Components	p. 25
Discrete vs Integrated Circuits	p. 26
Component Leads	p. 26
Polarity in Components	p. 27
Component Symbols	p. 28
Resistors	p. 29
Types of Resistors	p. 29
Packages	p. 31
Characteristics	p. 32
Variable Resistors or Potentiometers	p. 35
Light-dependent Resistors (LDRs)	p. 37
Thermistors	p. 37
Capacitors	p. 37
Types of Capacitors	p. 40
Packages	p. 42
Performance of Capacitors	p. 42
Variable Capacitors	p. 44
Inductors	p. 45
Diodes	p. 48
Special Types of Diodes	p. 50
Zener Diode	p. 51
Varactor Diode	p. 51
Varistor	p. 51
Light Emitting Diodes (LED)	p. 52
Photodiode	p. 53
Tunnel Diode (TD)	p. 53
Transistors	p. 54
Bipolar Transistors	p. 54
Power Transistors	p. 58
Darlington Transistors	p. 58
Field-effect Transistors	p. 59
Insulated Gate Bipolar Transistor (IGBT)	p. 62
Transistor Type Numbers	p. 63
Thyristors	p. 64
Integrated Circuits (ICs)	p. 67
Linear Integrated Circuits	p. 67
Operational Amplifiers (OP-AMP)	p. 68
Three-terminal Voltage Regulator	p. 71
Digital Integrated Circuits	p. 71
Logic Circuits	p. 72
Microprocessors	p. 81
Semiconductor Memories	p. 83
Random Access Memory	p. 84
Read Only Memory	p. 85
Microcontrollers	p. 88
Surface Mount Devices	p. 88
Surface Mount Devices	p. 89
Surface Mounting Semiconductor Packages	p. 92
Packaging of Passive Components as SMDs	p. 97
Heat Sinks	p. 97
Transformer	p. 99
Relays	p. 100
Connectors	p. 101
Useful Standards	p. 103
Layout Planning and Design	p. 104
Reading Drawings and Diagrams	p. 104
Block Diagram	p. 104
Schematic Diagram	p. 105
General PCB Design Considerations	p. 108
Important Design Elements	p. 109
Important Performance Parameters	p. 109
Mechanical Design Considerations	p. 110
Types of Boards	p. 110
Board Mounting Techniques	p. 115
Board Guiding and Retaining	p. 116
Input/Output Terminations	p. 117
Board Extraction	p. 118
Testing and Servicing	p. 118
Mechanical Stress	p. 118
Board Thickness	p. 118
Important Specifications and Standards	p. 119
Electrical Design Considerations	p. 119
Conductor Dimensions	p. 119
Resistance	p. 119
Capacitance Considerations	p. 124
Inductance of PCB Conductors	p. 126
High Electrical Stresses	p. 126
Conductor Patterns	p. 126
Component Placement Rules	p. 127
Conductor Width and Thickness	p. 127
Conductor Spacing	p. 129
Conductor Shapes	p. 130
Conductor Routing and Locations	p. 131
Supply and Ground Conductors	p. 132
Fabrication and Assembly Considerations	p. 134
Environmental Factors	p. 136
Thermal Considerations	p. 136
Contamination	p. 137
Shock and Vibration	p. 137
Cooling Requirements and Packaging Density	p. 139
Heat Sinks	p. 139
Packaging Density	p. 139
Package Style and Physical Attributes	p. 140
Layout Design	p. 142
Grid Systems	p. 143
Layout Scale	p. 143
Layout Sketch/Design	p. 144
Layout Considerations	p. 145
Materials and Aids	p. 145
Land Requirements	p. 146
Manual Layout Procedure	p. 147
Layout Methodology	p. 149
Layout Design Checklist	p. 150
General Considerations	p. 150
Electrical Considerations	p. 150
Mechanical Considerations	p. 151
Documentation	p. 151
Documentation File	p. 153
Useful Standards	p. 153
Design Considerations for Special Circuits	p. 155
Design Rules for Analog Circuits	p. 155
Component Placement	p. 155
Signal Conductors	p. 156
Supply and Ground Conductors	p. 161
General Rules for Design of Analog PCBs	p. 162
Design Rules for Digital Circuits	p. 162
Transmission Lines	p. 163
Problems in Design of PCBs for Digital Circuits	p. 164
Design Rules for High Frequency Circuits	p. 169
Design Rules for Fast Pulse Circuits	p. 171
Controlled Impedance Considerations	p. 172
Design Rules for PCBs for Microwave Circuits	p. 174
Basic Definitions	p. 174
Strip Line and Microstrip Line	p. 176
Transmission Lines as Passive Components	p. 179
General Design Considerations for Microwave Circuits	p. 181
Design Rules for Power Electronic Circuits	p. 182
Separating Power Circuits in High and Low Power Parts	p. 182
Base Material Thickness	p. 183
Copper Foil Thickness	p. 183
Conductor Width	p. 183
Resistive Drop of Voltage	p. 184
Thermal Considerations	p. 184
High-density Interconnection Structures	p. 185
Drivers for HDI	p. 186
Advantages of HDI	p. 187
Designing for HDI	p. 188
Electromagnetic Interference/Compatibility (EMI/EMC)	p. 190
Useful Standards	p. 192
Artwork Generation	p. 193
What is Artwork?	p. 193
Basic Approach to Manual Artwork	p. 193
Ink Drawing on White Card Board Sheets	p. 194
Black Taping on Transparent Base Foil	p. 194
Red and Blue Tape on Transparent Polyester Base Foil	p. 198
General Design Guidelines for Artwork Preparation	p. 198
Conductor Orientation	p. 199
Conductor Routing	p. 200
Conductor Spacing	p. 204
Hole Diameter and Solder Pad Diameter	p. 205
The Square Land/Pad	p. 210
Artwork Generation Guidelines	p. 210
No Conductor Zone	p. 210
Pad Centre Holes	p. 211
Conductor and Solder Pad Joints	p. 211
Film Master Preparation	p. 211
Photographic Film	p. 212
Exposure through Camera	p. 215
Dark Room	p. 216
Film Development	p. 217
Automated Artwork Generation	p. 219
Computer- Aided Design (CAD)	p. 220
System Requirements	p. 221
Basic CAD Operation	p. 223
Layout Procedure	p. 226
Library Manager	p. 228
Component Placement	p. 228
Conductor Routing	p. 232
Checking	p. 236
Design Automation	p. 239
How to Judge CAD Systems?	p. 240
Manual Versus Automation in PCB Design	p. 241
Photoplotter	p. 242
Vector Photoplotter	p. 243
Raster (Laser) Plotters	p. 243
Talking to Photoplotters	p. 244
Computer-Aided Manufacturing (CAM)	p. 245
Data Transfer Mechanisms	p. 251
PCB Design Checklist	p. 252
Useful Relevant Standards	p. 254
Copper Clad Laminates	p. 255
Anatomy of Laminates	p. 255
Fillers (Reinforcements)	p. 255
Resins	p. 256
Copper Foil	p. 257
Manufacture of Laminates	p. 259
Materials	p. 259
Process	p. 260
Properties of Laminates	p. 262
Electrical Properties	p. 263
Dielectric Strength	p. 263
Dielectric Constant	p. 264
Dissipation Factor	p. 264
Insulation Resistance	p. 265
Surface Resistivity	p. 265
Volume Resistivity	p. 266
Dielectric Breakdown	p. 267
Types of Laminates	p. 267
Phenolic Laminates	p. 267
Epoxy Laminates	p. 269
Glass Cloth Laminates	p. 269
Prepreg Material [B-Stage]	p. 271
PTFE (Polytetrafluoroethylene) Laminates	p. 272
Polyester Laminates (Mylar Lamination)	p. 273
Silicone Laminates	p. 273
Melamine Laminates	p. 273
Polyamide Laminates	p. 273
Teflon Laminates	p. 273
Mixed Dielectric Laminates	p. 273
Evaluation of Laminates	p. 274
Laminate Testing	p. 274
Surface and Appearance	p. 274
Water Absorption	p. 275
Punchability and Machinability	p. 276
Peel Strength	p. 276
Bond Strength	p. 277
Solder Resistance	p. 278
Warp and Twist	p. 278
Flexural Strength	p. 279
Flammability	p. 279
Glass Transition Temperature	p. 280
Dimensional Stability	p. 280
Copper Adhesion	p. 281
Useful Standards	p. 281
Image Transfer Techniques	p. 283
What is Image Transfer?	p. 283
Laminate Surface Preparation	p. 283
Manual Cleaning Process	p. 284
Mechanical Cleaning	p. 285
Test for Cleanliness	p. 287
Screen Printing	p. 287
Screen Frame	p. 288
Screen Cloth	p. 289
Screen Preparation	p. 290
Squeegees	p. 291
Pattern Transferring Techniques	p. 292
Screen Stencil Method	p. 292
Indirect Method [Transfer Type Screen Method]	p. 293
Knife-cut or Hand-cut Film Process	p. 293
Photographic Techniques	p. 294
Printing Inks	p. 295
Ultraviolet Curing Inks	p. 295
Printing Process	p. 296
Manual Screen Printing Process	p. 296
Automatic or Semi-automatic Screen Printing Process	p. 296
Photo Printing	p. 296
Liquid Photo-resist (Wet Film Resist)	p. 297
Dry Film Photo-resists	p. 298
Laser Direct Imaging (LDI)	p. 303
Benefits of LDI	p. 307
Legend Printing	p. 308
Useful Standards	p. 309
Plating Processes	p. 310
Need for Plating	p. 310
Electroplating	p. 313
The Basic Electroplating Process	p. 313
Faraday's Laws of Electrolysis	p. 314
Water Quality	p. 315
pH of a Solution	p. 316
Buffer	p. 316
Anodes	p. 317
Anode Bags	p. 317
Pre-treatment for Electroplating	p. 317
Plating Techniques	p. 317
Immersion Plating	p. 318
Electroless Plating	p. 318
Electroplating	p. 324
General Problems in Plating	p. 334
General Plating Defects	p. 334
Voids	p. 334
Blow Holes	p. 334
Outgassing	p. 334
Special Plating Techniques	p. 335
Through-hole Plating	p. 335
Reel-to-Reel Selective Plating	p. 335
Brush Plating	p. 336
Finger Plating	p. 336
Conductor Metal Paste Coating	p. 337
Reduction Silver Spraying	p. 338
Metal Distribution and Plating Thickness	p. 338
Analysis of Solution (Wet Chemical Analysis)	p. 338
Physical Tests for Solutions	p. 339
Testing of Electrodeposits	p. 341
Considerations for Shop Floor	p. 343
Plating Shop Layout	p. 344
Equipment	p. 345
Additive Processing	p. 346
Fully Additive Process	p. 347
Semi Additive Process	p. 349
Partially Additive Process	p. 349
Solder Mask	p. 352
Solder Resist Classification	p. 352
Liquid Film Solder Mask	p. 354
Dry Film Solder Masking	p. 354
Resolution	p. 357
Encapsulation	p. 357
Surface Topography Resist Thickness	p. 358
Placement Assistance	p. 358
Reliability of Solder Mask	p. 359
Soldering and Cleaning	p. 359
Tenting of Vias	p. 359
Solder Mask over Bare Copper [SMOBC]	p. 360
Conformal Coatings	p. 361
Materials for Conformal Coatings	p. 361
Methods of Applying Conformal Coatings	p. 363
Standards for Coatings	p. 363
Useful Standards	p. 363
Etching Techniques	p. 365
Etching Solutions and Chemistry	p. 365
Ferric Chloride	p. 366
Hydrogen Peroxide - Sulphuric Acid	p. 368
Chromic-Sulphuric Acid	p. 369
Cupric Chloride	p. 369
Ammonium Persulphate	p. 371
Alkaline Ammoniacal/Ammonium Chloride	p. 373
Etching Arrangements	p. 374
Simple Batch Production Etching	p. 374
Continuous Feed Etching	p. 374
Open Loop Regeneration	p. 375
Closed Loop Regeneration	p. 375
Etching Parameters	p. 376
Equipment and Techniques	p. 376
Immersion Etching	p. 376
Bubble Etching	p. 377
Splash Etching	p. 377
Spray Etching	p. 378
Etching Equipment Selection	p. 379
Optimizing Etchant Economy	p. 380
Problems in Etching	p. 380
Under-etching or Under-cut	p. 380
Overhang	p. 381
Facilities for Etching Area	p. 382
Electrochemical Etching	p. 382
Mechanical Etching	p. 382
Mechanical Operations	p. 384
Need for Mechanical Operations	p. 384
Cutting Methods	p. 385
Shearing	p. 385
Sawing	p. 385
Blanking of PCBs	p. 386
Milling	p. 387
Routing of PCBs	p. 387
Hole Punching	p. 390
Drilling	p. 391
Drill Bit Geometry and its Importance	p. 393
Types of Drill Bits	p. 395
Drill Bit Inspection	p. 396
Drill Bit Sizes	p. 397
Tool Life and Re-grinding (Re-pointing)	p. 398
Requirements in Drilling	p. 398
Drill Speed, Feed and Withdrawal Rates	p. 398
Function of Clean Holes	p. 399
Drill Entry and Exit (Back-up) Materials	p. 400
Use of Drill Bush/Collar	p. 401
Drilling and Types of Laminates	p. 402
Drilling Problems	p. 403
Drilling Machines	p. 403
Microvias	p. 406
Photo-formed Vias	p. 406
Plasma Etching	p. 407
Laser-formed Vias	p. 407
Use of UV Laser for Drilling PCB	p. 409
Hybrid Laser Drilling Process	p. 410
Useful Standards	p. 413
Multi-layer Boards	p. 414
What are Multi-layers?	p. 414
Interconnection Techniques	p. 415
Conventional Plated Through-hole	p. 415
Buried Via	p. 416
Blind Vias	p. 416
Materials for Multi-layer Boards	p. 417
Resin System	p. 417
Reinforcement Materials	p. 417
Prepreg	p. 418
Copper Foil	p. 418
Design Features of Multi-layer Boards	p. 418
Mechanical Design Considerations	p. 419
Electrical Design Considerations	p. 420
Fabrication Process for Multi-layer Boards	p. 421
General Process	p. 421
Lamination	p. 422
Post-lamination Process	p. 423
Multi-layer Drilling	p. 424
Schematic Key for Multi-layer Built-ups	p. 424
Useful Standards	p. 425
Flexible Printed Circuit Boards	p. 427
What are Flexible Printed Circuit Boards?	p. 427
Construction of Flexible Printed Circuit Boards	p. 428
Films - Types and Their Characteristics	p. 429
Foils	p. 433
Adhesives	p. 436
Design Considerations in Flexible Circuits	p. 440
Difference in Design Considerations of Rigid and Flexible Circuits	p. 440
Step-by-step Approach to Designing of a Flex Circuit	p. 444
Designing for Flexibility and Reliability	p. 444
Manufacture of Flexible Circuits	p. 446
Rigid Flex Printed Circuit Boards	p. 448
Terminations	p. 449
Advantages of Flexible Circuits	p. 451
Special Applications of Flexible Circuits	p. 451
Useful Standards	p. 452
Soldering, Assembly and Re-working Techniques	p. 453
What is Soldering?	p. 453
Theory of Soldering	p. 454
The Wetting Action	p. 455
Surface Tension	p. 455
Creation of an Inter-metallic Compound	p. 455
The Wetting Angle	p. 457
Soldering Variables	p. 457
Temperature and Time Taken for Soldering	p. 457
Tarnish-free Surface	p. 457
Application of Right Flux and Proper Solder	p. 458
Soldering Material	p. 458
Solder	p. 458
Flux	p. 462
Soldering and Brazing	p. 466
Solders for Hard Soldering/Brazing	p. 466
Soldering Tools	p. 466
Soldering Iron	p. 466
Other Hand Soldering Tools	p. 472
Cutters	p. 473
Pliers	p. 474
Strippers	p. 475
Bending Tools	p. 476
Heat Sinks	p. 476
General Cleaning Tools	p. 476
Hand Soldering	p. 477
Hand Soldering Requirements	p. 477
Steps in Hand Soldering	p. 478
Soldering Leadless Capacitors	p. 480
PCB Assembly Process	p. 481
Leaded Through-hole Assembly	p. 482
Surface Mount Assembly	p. 488
Combinations of Mixed Technologies	p. 492
Solder Pastes for SMDS	p. 494
Requirements of Solder Pastes	p. 495
Composition of Solder Pastes	p. 495
Solder Paste Application	p. 496
Handling of Solder Paste	p. 496
Stencil Printing of Solder Paste	p. 497
Screen Printing of Solder Paste	p. 498
Pre-forms of Solder	p. 501
No-clean Solder Paste	p. 501
Adhesive for Mixed Technology Assembly	p. 501
Requirements of Adhesive	p. 502
Application of Adhesive	p. 502
Mass Soldering	p. 504
Dip Soldering	p. 504
Drag Soldering	p. 505
Wave Soldering	p. 505
Reflow Soldering	p. 512
Vapour Phase System	p. 517
Post-soldering Cleaning	p. 519
Types of Contamination	p. 519
Solvents and Cleaning Methods	p. 520
Quality Control of Solder Joints	p. 521
Good Quality Solder Joints	p. 522
Common Soldering Faults	p. 522
Solder Joint Defects and their Common Causes	p. 528
Health and Safety Aspects	p. 531
Electrostatic Discharge Control	p. 532
Fundamentals of ESD	p. 533
Electrostatic Voltages Generated by Various Operations	p. 534
Sensitivity of Various Components to ESD Voltages	p. 535
Electrostatic Protection	p. 535
Anti-static Workstation	p. 536
A Proper Assembly Environment	p. 537
Component Handling	p. 538
Special Considerations for Handling MOS Devices	p. 539
Education/Certificate for ESD Control	p. 541
Re-work and Repair of Printed Circuit Boards	p. 541
Approaching Components for Tests	p. 542
De-soldering Techniques	p. 543
Replacement of Components	p. 546
Repairing Surface Mounted PCBs	p. 549
Cut all Leads	p. 549
Heating Methods	p. 550
Removal and Replacement of Surface Mount Devices	p. 551
Re-work Stations	p. 554
Useful Standards	p. 557
Quality, Reliability and Acceptability Aspects	p. 561
What is Quality Assurance?	p. 561
Classification of Defects	p. 562
Defectives	p. 562
Acceptability Quality Level (AQL)	p. 562
Quality Control Programme	p. 563
Statistical Process Control and Sampling Plan	p. 563
Testing for Quality Control	p. 564
Characteristics for Testing for Quality Assurance	p. 565
Designing a QA Programme	p. 566
Incoming QA	p. 567
Traceability	p. 567
Quality Control Methods	p. 567
Micro-sectioning	p. 568
Testing of Printed Circuit Boards	p. 570
Automatic Board Testing	p. 571
Bare Board Testing (BBT)	p. 573
Testing of Assembled Boards	p. 579
Reliability Testing	p. 581
Reliability of Printed Circuit Boards	p. 581
Acceptability of PCBs	p. 584
Acceptance Criteria	p. 585
Inspection of Assembled PCBs	p. 586
Inspection Techniques	p. 587
Acceptability Criteria	p. 596
Useful Standards	p. 607
Environmental Concerns in PCB Industry	p. 611
Pollution Control in PCB Industry	p. 611
Polluting Agents	p. 612
Recycling of Water	p. 613
Recovery Techniques	p. 613
Filtration	p. 614
Water Use Reduction Technique	p. 614
Ion Exchange System	p. 615
Reverse Osmosis	p. 617
Evaporative Recovery	p. 618
Precipitation of Heavy Metals	p. 619
Electrolytic Recovery	p. 619
Air Pollution	p. 620
Dust	p. 621
Fumes	p. 621
Clean Environment in Assembly Rooms	p. 622
Recycling of Printed Circuit Boards	p. 623
Present Approach to PCB Scrap Disposal	p. 623
Characteristics of PCB Scrap	p. 625
Dis-assembly of Equipment	p. 625
Technologies of Recycling of PCBs	p. 626
Environmental Standards	p. 628
Safety Precautions for the Personnel	p. 629
Toxic Chemicals in PCB Fabrication	p. 629
Lead-free Soldering	p. 630
Substitutes for Tin/Lead Solders	p. 632
Useful Standards	p. 633
Glossary	p. 635
References	p. 667
Index	p. 678
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